Product development is a process that has applications beyond just the production of goods. While we traditionally think of product development in association with something tangible, the process can equally be applied to software, service industries, and even to government.
Refractories manufacturers are likely well-versed in the special requirements that these products have for shipping purposes. While these materials can be transported via different modes (e.g., ground, ship or air), intermodal shipping is a great transportation solution (depending on the shipment lane).
During firing, a glaze applied on a ceramic body undergoes several transformations, including water loss from the clay components, glass transition and softening. During the softening phase, the glaze starts to melt, giving rise to a continuous liquid layer.
The continuing development of ceramic materials, along with an increasing number of industrial applications, is posing new challenges for the materials science industry.
Measuring the elastic properties of a green ceramic as it is being fired can be difficult and often requires sophisticated non-destructive testing (NDT) techniques. One effective method is called the the impulse excitation technique (IET).
Acoustic micro-imaging tools perform the non-destructive imaging and analysis of internal features (including anomalies and defects) in advanced ceramics and other materials by pulsing ultrasound into the sample and receiving the return echoes.
In today’s manufacturing world, materials production and supply have grown increasingly complex. Business moves quickly, information is exchanged across the globe almost instantaneously, and pressure for immediate performance can be extremely high—even in industries that require long production cycles. As a result, product shipment and quality assurance can often struggle to keep up with the breakneck pace and expectations.
An internal structural defect in a ceramic chip capacitor becomes activated when it expands to create an electrical leakage path between two adjacent electrode layers.