Perhaps the most impactful invention in modern history, the transistor is at the core of semiconductor devices and has dramatically transformed virtually every industry while helping spawn many new ones. As illustrated in Figure 1, today’s microchips can contain over a billion transistors and are improving our cars, phones, and refrigerators—empowering internet searches, genetic research, and smart sensors. How different would our world be today without these integrated circuit (IC) “microchips?”
Aluminum nitride (AlN) powder filler plays an important role in producing next-generation, high-performance resins (e.g., those with high thermal conductivity of around 10 W/m-K, as well as electric insulation).
Goodfellow Ceramic and Glass Division recently announced the availability of Shapal™ Hi-M soft, a composite sintered body of aluminum nitride (AlN) and boron nitride (BN).
Centorr Vacuum Industries (CVI) recently announced it has shipped orders for two high-temperature sintering furnaces to a leading China-based firm in the production of aluminum nitride (AlN) substrates for the LED market.
Welcome to our annual Materials Handbook issue! The handbook is organized with a definition/description for each material (listed alphabetically), followed by the names of suppliers that provide the material.
Reportedly ideal for the rapidly growing LED market and other markets where high heat dissipation is useful, these ceramic substrates offer a thermal conductivity of 170 W/m K.